Influence of die attachment on MOS transistor matching

IEEE Transactions on Semiconductor Manufacturing

Volumn 10, Issue 2, 1997, Pages 209-218

  Bastos, Jose ^b   Steyaert, Michel S J ^a,b   Pergoot, Anelia ^c   Sansen, Willy M ^a,b  

^a IEEE

^b UNIVERSITY OF LEUVEN   (Belgium)

^c LUCENT TECHNOLOGIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; CMOS INTEGRATED CIRCUITS; DIES; INTEGRATED CIRCUIT TESTING; POLYMER BLENDS; RESIDUAL STRESSES;

METAL OXIDE SEMICONDUCTOR TRANSISTOR MATCHING;

MOS DEVICES;

EID: 0031144133     PISSN: 08946507     EISSN: None     Source Type: Journal    
DOI: 10.1109/66.572070     Document Type: Article

References (14)

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