Method for modelling substrate coupling in large chip designs

Electronics Letters

Volumn 33, Issue 11, 1997, Pages 952-954

  Singh, R ^a   Sali, S ^a  

^a NEWCASTLE UNIVERSITY   (United Kingdom)

Author keywords

Mixed analogue digital integrated circuit; SPICE; Substrates

Indexed keywords

COMPUTER SIMULATION; COMPUTER SOFTWARE; DIGITAL CIRCUITS; ELECTRIC NETWORK ANALYSIS; LSI CIRCUITS;

MIXED ANALOG-DIGITAL INTEGRATED CIRCUIT; SOFTWARE PACKAGE SPICE;

SUBSTRATES;

EID: 0031142495     PISSN: 00135194     EISSN: None     Source Type: Journal    
DOI: 10.1049/el:19970639     Document Type: Article

References (5)

1. SU D.K., LOINAZ, M.J., MASUI, S., and WOOLEY, B.A.: 'Experimental results and modelling techniques for substrate noise in mixed-signal integrated circuits', IEEE J. Solid-State Circuits, 1993, 28, (4), pp. 420-429
2. VERGHESE N.K., SCHMERBECK T.J., and ALLSTOT D.J.: 'Simulation techniques and solutions for mixed-signal coupling in integrated circuits' (Kluwer Academic Publishers, 1995), pp. 125-134
3. SINGH, R., and SALI, S.: 'Efficient modelling of substrate noise and coupling in mixed-signal SPICE designs', Electron. Lett., 1997, 33, (7), pp. 590-592
4. Microsim Corporation: 'MicroSim PSPICE A/D - Circuit analysis reference manual'. Version 6.2, California, USA, 1995
5. MILIOZZI, P., CARLOM, L., CHARBON, E., and SANGIOVANNI-VINCENTELLI, A.: 'SUBWAVE : A methodology for modeling digital substrate noise injection in mixed-signal ICs'. Proc. IEEE Custom Integ. Circuits Conf., 1996, pp. 385-388