High temperature fatigue crack growth mechanism and effect of grain size on crack growth behavior in silicon nitride

Zairyo/Journal of the Society of Materials Science, Japan

Volumn 46, Issue 5, 1997, Pages 518-525

  Miyashita, Yukio ^a   Hansson, Thomas ^b   Mutoh, Yoshiharu ^a   Kita, Hideki ^c  

^a NAGAOKA UNIVERSITY OF TECHNOLOGY   (Japan)

^b VOLVO AERO CORPORATION   (Sweden)

^c Isuzu Ceramics Res Inst Co Ltd   (Japan)

Author keywords

Fatigue crack growth; Glass phase; Grain size; High temperature; Mechanism; Silicon nitride

Indexed keywords

CRACK PROPAGATION; FATIGUE OF MATERIALS; GLASS TRANSITION; GRAIN BOUNDARIES; GRAIN SIZE AND SHAPE; HIGH TEMPERATURE PROPERTIES; RHEOLOGY; SHEAR DEFORMATION;

CRACK GROWTH RESISTANCE;

SILICON NITRIDE;

EID: 0031142370     PISSN: 05145163     EISSN: None     Source Type: Journal    
DOI: 10.2472/jsms.46.518     Document Type: Article

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