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Volumn 26, Issue 5, 1997, Pages 12-13
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SM components-flipchips
a
a
NONE
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Author keywords
[No Author keywords available]
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Indexed keywords
ADHESIVES;
OXIDATION;
POLYMERS;
PRINTED CIRCUIT BOARDS;
SEMICONDUCTOR DEVICE MANUFACTURE;
SOLDERING ALLOYS;
SUBSTRATES;
SURFACE MOUNT TECHNOLOGY;
THERMAL CYCLING;
EUTECTIC SOLDER;
HIGH LEAD CONTENT SOLDER;
REFLOW SOLDERING;
WIRE BONDED CHIP ON BOARD;
FLIP CHIP DEVICES;
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EID: 0031141279
PISSN: 0306333X
EISSN: None
Source Type: Journal
DOI: None Document Type: Article |
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Times cited : (1)
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References (0)
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