The effect of copper implantation on the mechanical, structural properties and residual stress of polycrystalline alumina

Thin Solid Films

Volumn 300, Issue 1-2, 1997, Pages 197-201

  Halitim, F ^a   Ikhlef, N ^b   Boudoukha, L ^c   Fantozzi, G ^c  

^a CPE LYON   (France)

^b ECOLE CENTRALE DE LYON   (France)

^c UNIVERSITÉ DE LYON   (France)

Author keywords

Surface stress; Surface structure; X ray diffraction

Indexed keywords

ALUMINA; COPPER; FRACTURE TOUGHNESS; HARDNESS; HEAT TREATMENT; ION IMPLANTATION; MORPHOLOGY; POLYCRYSTALLINE MATERIALS; RESIDUAL STRESSES; RUTHERFORD BACKSCATTERING SPECTROSCOPY; SCANNING ELECTRON MICROSCOPY; X RAY DIFFRACTION ANALYSIS;

RESIDUAL SURFACE COMPRESSIVE STRESSES;

CERAMIC COATINGS;

EID: 0031141149     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0040-6090(96)09492-8     Document Type: Article

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