메뉴 건너뛰기




Volumn 18, Issue 5, 1997, Pages 232-234

Electrical characterization of dielectrically isolated silicon substrates containing buried metallic layers

Author keywords

[No Author keywords available]

Indexed keywords

CAPACITORS; DIELECTRIC MATERIALS; SEMICONDUCTING SILICON; SUBSTRATES; TUNGSTEN COMPOUNDS;

EID: 0031139635     PISSN: 07413106     EISSN: None     Source Type: Journal    
DOI: 10.1109/55.568777     Document Type: Article
Times cited : (6)

References (9)
  • 1
    • 33644949327 scopus 로고
    • Bonding of silicon wafers for silicon-on-insulator
    • Nov.
    • W. P. Maszara, G. Goetz, A. Caviglia, and J. B. McKitterick, "Bonding of silicon wafers for silicon-on-insulator," J. Appl. Phys., vol. 64, pp. 4943-4950, Nov. 1988.
    • (1988) J. Appl. Phys. , vol.64 , pp. 4943-4950
    • Maszara, W.P.1    Goetz, G.2    Caviglia, A.3    McKitterick, J.B.4
  • 2
    • 0023043012 scopus 로고
    • Wafer bonding for silicon-on-insulator technologies
    • Jan.
    • J. B. Lasky, "Wafer bonding for silicon-on-insulator technologies," Appl. Phys. Lett., vol. 48, pp. 78-80, Jan. 1986.
    • (1986) Appl. Phys. Lett. , vol.48 , pp. 78-80
    • Lasky, J.B.1
  • 3
    • 0344160765 scopus 로고
    • The benefits of bonding silicon on insulator for bipolar Ics
    • Nov.
    • P. Saul, "The benefits of bonding silicon on insulator for bipolar Ics," IEE Rev., pp. 263-266, Nov. 1994.
    • (1994) IEE Rev. , pp. 263-266
    • Saul, P.1
  • 5
    • 0028466825 scopus 로고
    • Silicon-on-insulator devices for high-voltage and power IC applications
    • July
    • E. Arnold, "Silicon-on-insulator devices for high-voltage and power IC applications," J. Electrochem. Soc., vol. 141, pp. 1983-1988, July 1994.
    • (1994) J. Electrochem. Soc. , vol.141 , pp. 1983-1988
    • Arnold, E.1
  • 6
    • 0026925274 scopus 로고
    • A smart power process in direct bonded silicon on insulator with 150 V VDMOS, CMOS, and bipolar transistors
    • T. Ifström, U. Apel, H. G. C. Harendt, and B. Höfflinger, "A smart power process in direct bonded silicon on insulator with 150 V VDMOS, CMOS, and bipolar transistors," Microelectron. Eng., vol. 19, pp. 153-156, 1992.
    • (1992) Microelectron. Eng. , vol.19 , pp. 153-156
    • Ifström, T.1    Apel, U.2    Harendt, H.G.C.3    Höfflinger, B.4
  • 7
    • 0027579074 scopus 로고
    • Advanced metal oxide semiconductor and bipolar devices on bonded silicon-on-insulator
    • Apr.
    • Y. Arimoto, H. Horie, N. Higaki, M. Kojima, F. Sugimoto, and T. Ito, "Advanced metal oxide semiconductor and bipolar devices on bonded silicon-on-insulator," J. Electrochem. Soc., vol. 140, pp. 1138-1143, Apr. 1993.
    • (1993) J. Electrochem. Soc. , vol.140 , pp. 1138-1143
    • Arimoto, Y.1    Horie, H.2    Higaki, N.3    Kojima, M.4    Sugimoto, F.5    Ito, T.6
  • 8
    • 3142718591 scopus 로고
    • Speed, power, and yield comparison of thin bonded SOI versus bulk CMOS technologies
    • Oct.
    • E. D. Nowak, L. Ding, Y. T. Loh, and C. Hu, "Speed, power, and yield comparison of thin bonded SOI versus bulk CMOS technologies," in Proc. IEEE Int. SOI Conf, Oct. 1994, pp. 41-42.
    • (1994) Proc. IEEE Int. SOI Conf , pp. 41-42
    • Nowak, E.D.1    Ding, L.2    Loh, Y.T.3    Hu, C.4


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.