Development of moulded pulp materials for the packaging of electronic equipment

Packaging Technology and Science

Volumn 10, Issue 3, 1997, Pages 161-168

  Noguchi, Tsutomu ^a   Miyashita, Mayumi ^a   Seto, JuN'Etsu ^a   Tan, Masaru ^a   Kawano, Mitoshi ^a  

^a SONY CORPORATION   (Japan)

Author keywords

Microspheres; Moulded pulp; Shock absorbing properties; Shredded pulp; Starch binder

Indexed keywords

COMPRESSIVE STRENGTH; ELECTRONIC EQUIPMENT; PULP MATERIALS;

MICROSPHERES; MOLDED PULP; SHREDDED PULP; STARCH BINDERS;

PACKAGING;

EID: 0031130963     PISSN: 08943214     EISSN: None     Source Type: Journal    
DOI: 10.1002/(SICI)1099-1522(19970501/30)10:3<161::AID-PTS391>3.0.CO;2-1     Document Type: Article

References (4)

1. Akiyoshi, T. Packaging Technology, 6, 24-26 (1991) (in Japanese).
2. Kikuchi, T. Nikkei Mechanical, 8, 32-38 (1991) (in Japanese).
3. Noguchi, T. Miyashita, M. and Seto, J. Trans. Mat. Res. Soc. Jpn, 18A, 293-296 (1993).
4. Noguchi, T., Miyashita, M., Seto, J., Tan, M. and Kawano, M. Proceedings Supplement of International Ecomaterials Conference, Vol. 13 (1995).