Study of failure modes of microelectronic packaging modules by holography quasi projection moire method

Acta Mechanica Sinica/Lixue Xuebao

Volumn 13, Issue 2, 1997, Pages 179-185

  Xunqing, Shi ^a   Baochen, Liu ^b   Fulong, Dai ^b  

^a BEIHANG UNIVERSITY   (China)

^b TSINGHUA UNIVERSITY   (China)

Author keywords

Failure modes; Holography; Packaging modules; Quasi projection moire; Sensitivity

Indexed keywords

HOLOGRAPHY; MICROELECTRONICS; MOIRE FRINGES;

FAILURE MODES; PACKAGING MODULES; QUASI PROJECTION MOIRE; SENSITIVITY;

FAILURE (MECHANICAL);

EID: 0031130141     PISSN: 05677718     EISSN: None     Source Type: Journal    
DOI: 10.1007/bf02487925     Document Type: Article

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