SCOPUS 정보 검색 플랫폼

Journal of Materials Research

Volumn 12, Issue 4, 1997, Pages 1048-1055

Joining of AlN to Cu using In-base active brazing fillers

(2) Huh, Dae a Kim, Dae Hun b

a Chungnam Reg Indust Technol Inst (South Korea)

b Korea Institute of Machine and Materials (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM COMPOUNDS; BOND STRENGTH (CHEMICAL); BRAZING FILLER METALS; COPPER; CRYSTAL MICROSTRUCTURE; FRACTURE; INDIUM ALLOYS; INTERFACES (MATERIALS); SUBSTRATES; VACUUM BRAZING; WETTING;

ALUMINUM NITRIDE;

CERAMIC MATERIALS;

EID: 0031124379 PISSN: 08842914 EISSN: None Source Type: Journal
DOI: 10.1557/JMR.1997.0146 Document Type: Article

Times cited : (17)

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