Equilibrium shapes of axisymmetric liquid solder menisci around a verrical cylinder on a horizontal substrate

Journal of Chemical Engineering of Japan

Volumn 30, Issue 2, 1997, Pages 302-309

  Gu, Yongan ^a   Li, Dongqing ^a  

^a UNIVERSITY OF ALBERTA   (Canada)

Author keywords

Capillary Meniscus; Contact Angle; Laplace Equation; Solder Joint; Soldering Strength Analysis

Indexed keywords

BOUNDARY CONDITIONS; CAPILLARITY; CAPILLARY FLOW; CONTACT ANGLE; LAPLACE TRANSFORMS; SOLDERED JOINTS; SOLDERING; STRENGTH OF MATERIALS;

AXISYMMETRIC LIQUID SOLDER MENISCI; CAPILLARY MENISCUS; EQUILIBRIUM SHAPES; FOURTH ORDER RUNGE-KUTTA TECHNIQUE; SHOOTING METHOD; SOLDERING STRENGTH ANALYSIS;

PHASE EQUILIBRIA;

EID: 0031123864     PISSN: 00219592     EISSN: None     Source Type: Journal    
DOI: 10.1252/jcej.30.302     Document Type: Article

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