|
|
Volumn 8, Issue 4, 1997, Pages 215-226
|
|
Recent development of advanced functional polymers for semiconductor encapsulants of integrated circuit chips and high-temperature photoresist for electronic applications
a
a
KEIO UNIVERSITY
(Japan)
|
|
Author keywords
[No Author keywords available]
|
|
Indexed keywords
AROMATIC POLYMERS;
ELECTRONICS PACKAGING;
ENCAPSULATION;
EPOXY RESINS;
FLAME RETARDANTS;
FREE RADICALS;
INTEGRATED CIRCUITS;
IONS;
PHOTORESISTS;
PLASTIC COATINGS;
POLYIMIDES;
RANDOM ACCESS STORAGE;
ION RADICAL MECHANISMS;
PLASTICS APPLICATIONS;
|
|
EID: 0031123511
PISSN: 10427147
EISSN: None
Source Type: Journal
DOI: 10.1002/(SICI)1099-1581(199704)8:4<215::AID-PAT630>3.0.CO;2-G Document Type: Article |
|
Times cited : (48)
|
|
References (23)
|
