Yield learning in integrated circuit package assembly

IEEE transactions on components, packaging and manufacturing technology. Part C. Manufacturing

Volumn 20, Issue 2, 1997, Pages 133-141

  Balasubramaniam, Shankar ^a   Sarwar, Abul K ^a   Walker, D M H ^a  

^a TEXAS INSTRUMENTS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; CERAMIC MATERIALS; ENCAPSULATION; INTEGRATED CIRCUIT LAYOUT; LAMINATES; RESOURCE ALLOCATION; SPREADSHEETS; SUBSTRATES; TUNING;

TAPE AUTOMATED BONDING (TAB); YIELD LEARNING;

ELECTRONICS PACKAGING;

EID: 0031119953     PISSN: 10834400     EISSN: None     Source Type: Journal    
DOI: 10.1109/3476.622883     Document Type: Article

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