Finite element analysis of thermal stresses in high-power substrates for hybrid circuits

Materials and Design

Volumn 18, Issue 2, 1997, Pages 61-72

  Manning, A S ^a   Fuchs, S ^a  

^a Institute for Clean Growth and Future Mobility   (United Kingdom)

Author keywords

Aluminium composites; Design analysis; Failure prediction; Finite element analysis; Strain distribution

Indexed keywords

ALUMINUM; COMPOSITE MATERIALS; CRACK PROPAGATION; ELASTIC MODULI; FAILURE ANALYSIS; FINITE ELEMENT METHOD; HYBRID INTEGRATED CIRCUITS; MATHEMATICAL MODELS; STRAIN; STRESS ANALYSIS; THERMAL EXPANSION; THERMAL STRESS;

THERMAL EXPANSION COEFFICIENT;

SUBSTRATES;

EID: 0031109299     PISSN: 02613069     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0261-3069(97)00031-9     Document Type: Article

References (7)

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