Attenuation in silver-filled conductive epoxy interconnects

IEEE Transactions on Components Packaging and Manufacturing Technology Part A

Volumn 20, Issue 1, 1997, Pages 52-59

  Wentworth, Stuart M ^a,b   Dillaman, Brian L ^a,b   Chadwick, Jon R ^b   Ellis, Charles D ^b   Johnson, R Wayne ^a,b  

^a IEEE

^b AUBURN UNIVERSITY   (United States)

Author keywords

Attenuation; Conductive adhesives; Microstrip; Screen printing; Stencil printing

Indexed keywords

CONDUCTIVE MATERIALS; ELECTRIC CONDUCTIVITY; ELECTRIC NETWORK ANALYZERS; ELECTROMAGNETIC WAVE ATTENUATION; ELECTROMAGNETIC WAVE SCATTERING; ETCHING; MICROSTRIP LINES; PHOTOLITHOGRAPHY; PLASTIC ADHESIVES; SCREEN PRINTING; SILVER; THERMAL CONDUCTIVITY;

AREA BONDING CONDUCTIVE ADHESIVE; CONDUCTIVE EPOXY INTERCONNECTS; POLYMER MATRIX; SILVER FLAKE FILL; STENCIL PRINTING;

MICROELECTRONIC PROCESSING;

EID: 0031100296     PISSN: 10709886     EISSN: None     Source Type: Journal    
DOI: 10.1109/95.558544     Document Type: Article

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