-
1
-
-
0024121804
-
Microelectronic Cooling by Enhanced Pool Boiling of a Dielectric Fluorocarbon Liquid
-
HTD
-
Anderson, T. M., and Mudawwar, I., 1988, “Microelectronic Cooling by Enhanced Pool Boiling of a Dielectric Fluorocarbon Liquid,” Proceedings of National Heat Transfer Conference, HTD-Vol. 96, pp. 551-560.
-
(1988)
Proceedings of National Heat Transfer Conference
, vol.96
, pp. 551-560
-
-
Anderson, T.M.1
Mudawwar, I.2
-
2
-
-
0003103239
-
Heat Transfer in Electronic Packages
-
R. R. Tummala and E. J., Rymaszewski, eds., Van Nostrand Reinhold, New York
-
Antonetti, V. W., Oktay, S., and Simons, R. E., 1989, “Heat Transfer in Electronic Packages,” Microelectronics Packaging Handbook, R. R. Tummala and E. J., Rymaszewski, eds., Van Nostrand Reinhold, New York, pp. 167-223.
-
(1989)
Microelectronics Packaging Handbook
, pp. 167-223
-
-
Antonetti, V.W.1
Oktay, S.2
Simons, R.E.3
-
3
-
-
0015605221
-
Liquid immersion Cooling of Small Electronic Devices
-
Baker, E., 1973, “Liquid immersion Cooling of Small Electronic Devices,” Microelectronic and Reliability, Vol. 12, pp. 163-173.
-
(1973)
Microelectronic and Reliability
, vol.12
, pp. 163-173
-
-
Baker, E.1
-
5
-
-
0023847228
-
Wall Superheat Excursions in the Boiling Incipience of Dielectric Fluids
-
Bar-Cohen, A., and Simon, T. W., 1988, “Wall Superheat Excursions in the Boiling Incipience of Dielectric Fluids,” Heat Transfer Engineering, Vol. 9, No. 3, pp. 19-31.
-
(1988)
Heat Transfer Engineering
, vol.9
, Issue.3
, pp. 19-31
-
-
Bar-Cohen, A.1
Simon, T.W.2
-
6
-
-
85025207873
-
-
Hemisphere, New York, NY
-
Bergles, A. E., and Bar-Cohen, A., 1990, Direct Liquid Cooling of MicroElectronic Components, Advances in Thermal Modeling of Electronic Components and Systems: Vol II, Hemisphere, pp. 233 - 342, New York, NY.
-
(1990)
Direct Liquid Cooling of Microelectronic Components, Advances in Thermal Modeling of Electronic Components and Systems: Vol II
-
-
Bergles, A.E.1
Bar-Cohen, A.2
-
7
-
-
0024140479
-
A Method to Reduce Temperature Overshoots in Immersion Cooling of Microelectronic Devices
-
IEEE 88CH2590-8, May
-
Bergles, A. E., and Kim, C.-J., 1988, “A Method to Reduce Temperature Overshoots in Immersion Cooling of Microelectronic Devices,” Proceedings of Intersociety Conference on Thermal Phenomena in the Fabrication and Operation of Electronic Components, IEEE 88CH2590-8, pp. 100-105, May.
-
(1988)
Proceedings of Intersociety Conference on Thermal Phenomena in the Fabrication and Operation of Electronic Components
, pp. 100-105
-
-
Bergles, A.E.1
Kim, C.-J.2
-
8
-
-
0022793383
-
Natural Convection on Horizontal, Inclined and Vertical Plates with Variable Surface Temperature or Heat Flux
-
Chen, T. S., Tien, H. C., and Armaly, B. F., 1986, “Natural Convection on Horizontal, Inclined and Vertical Plates with Variable Surface Temperature or Heat Flux,” International Journal of Heat Mass Transfer, Vol. 29, No. 10, pp. 1465-1478.
-
(1986)
International Journal of Heat Mass Transfer
, vol.29
, Issue.10
, pp. 1465-1478
-
-
Chen, T.S.1
Tien, H.C.2
Armaly, B.F.3
-
9
-
-
0002477246
-
Describing Uncertainties in SingleSample Experiments
-
Jan
-
Kline, S. J., and McClintock, F. A., 1983, “Describing Uncertainties in SingleSample Experiments,” Mechanical Engineering, Vol. 75, pp. 3-8, Jan.
-
(1983)
Mechanical Engineering
, vol.75
, pp. 3-8
-
-
Kline, S.J.1
McClintock, F.A.2
-
10
-
-
0024882608
-
Critical Heat Flux in Forced Convection Boiling From Small Regions
-
HTD, R. Goldstein, L. Chow, and E. Anderson, eds
-
Lee, T., and Simon, T. W., 1989, “Critical Heat Flux in Forced Convection Boiling From Small Regions,” HTD-Vol. 119, Heat Transfer in High Energy/High Heat Flux Application, R. Goldstein, L. Chow, and E. Anderson, eds., pp. 1-8.
-
(1989)
Heat Transfer in High Energy/High Heat Flux Application
, vol.119
, pp. 1
-
-
Lee, T.1
Simon, T.W.2
-
11
-
-
0024124621
-
Single and Two-Phase Convective Heat Transfer From Smooth and Enhanced Microelectronic Heat Sources in a Rectangular Channel
-
HTD
-
Maddox, D. E., and Mudawwar, I., 1988, “Single and Two-Phase Convective Heat Transfer From Smooth and Enhanced Microelectronic Heat Sources in a Rectangular Channel,” Proceedings of National Heat Transfer Conference, HTD-Vol. 96, pp. 533-541.
-
(1988)
Proceedings of National Heat Transfer Conference
, vol.96
, pp. 533-541
-
-
Maddox, D.E.1
Mudawwar, I.2
-
12
-
-
0020140323
-
Contributions to the Theory of Single-Sample Uncertainty Analysis, ASME
-
Moffat, R. J., 1982, Contributions to the Theory of Single-Sample Uncertainty Analysis, ASME Journal of Fluids Engineering, Vol. 104, pp. 250-260.
-
(1982)
Journal of Fluids Engineering
, vol.104
, pp. 250-260
-
-
Moffat, R.J.1
-
13
-
-
85008571330
-
Thermal Management of Electronic Equipment: A Review of Technology and Research Topics
-
Dec
-
Nakayama, W., 1986, “Thermal Management of Electronic Equipment: a Review of Technology and Research Topics,” Applied Mechanical Review, Vol. 39, No. 12, p. 1847, Dec.
-
(1986)
Applied Mechanical Review
, vol.39
, Issue.12
, pp. 1847
-
-
Nakayama, W.1
-
14
-
-
0347762400
-
Enhanced Heat Sink Studs for Cooling of Microelectronic Components by Boiling
-
New Orleans, LA
-
Nakayama, W., Nakajima, T., and Hirasawa, S., 1984, “Enhanced Heat Sink Studs for Cooling of Microelectronic Components by Boiling,” Proceedings of ASME Winter Annual Meeting, New Orleans, LA.
-
(1984)
Proceedings of ASME Winter Annual Meeting
-
-
Nakayama, W.1
Nakajima, T.2
Hirasawa, S.3
-
15
-
-
0022680476
-
High Heat From a Small Package
-
Oktay, S., Hannemann, R., and Bar-Cohen, A., 1986, “High Heat From a Small Package,” Mechanical Engineering, pp. 36-42, March.
-
(1986)
Mechanical Engineering, Pp. 36-42, March
-
-
Oktay, S.1
Hannemann, R.2
Bar-Cohen, A.3
-
16
-
-
0346501751
-
Effects of Size of Simulated Microelectronic Chips on Boiling and Critical Heat Flux
-
HTD, Aug
-
Park, K.-A., and Bergles, A. E., 1985, “Effects of Size of Simulated Microelectronic Chips on Boiling and Critical Heat Flux,” Proceedings of 23rd National Heat Transfer Conference, HTD-Vol. 48, Aug.
-
(1985)
Proceedings of 23Rd National Heat Transfer Conference
, vol.48
-
-
Park, K.-A.1
Bergles, A.E.2
-
17
-
-
0022877206
-
Boiling Heat Transfer Characteristics of Simulated Microelectronic Chips with Detachable Heat Sinks
-
Park, K.-A., and Bergles, A. E., 1986, “Boiling Heat Transfer Characteristics of Simulated Microelectronic Chips with Detachable Heat Sinks,” Proceedings of 8th International Heat Transfer Conference, pp. 2099-2104.
-
(1986)
Proceedings of 8Th International Heat Transfer Conference
, pp. 2099-2104
-
-
Park, K.-A.1
Bergles, A.E.2
-
18
-
-
0002120396
-
Laminar Free Convection Heat Transfer From Downward-Facing Horizontal Surfaces of Finite Dimensions
-
Singh, S. N., Birkebak, R. C., and Drake, Jr., R. M., 1969, “Laminar Free Convection Heat Transfer From Downward-Facing Horizontal Surfaces of Finite Dimensions,” Progress in Heat and Mass Transfer, Vol. 2, pp. 87-98.
-
(1969)
Progress in Heat and Mass Transfer
, vol.2
, pp. 87-98
-
-
Singh, S.N.1
Birkebak, R.C.2
Drake, R.M.3
-
19
-
-
85025238995
-
-
TSI Inc., St Paul, Minneapolis, MN
-
Sorrentino, D., 1989, personal communication, TSI Inc., St Paul, Minneapolis, MN.
-
(1989)
Personal Communication
-
-
Sorrentino, D.1
-
20
-
-
0025206482
-
Contact Angle Effects on Boiling Incipience of Highly-Wetting Liquids
-
Tong, W., Bar-Cohen, A., Simon, T. W., and You, S. M., 1990, ‘ ‘Contact Angle Effects on Boiling Incipience of Highly-Wetting Liquids,” International Journal of Heat and Mass Transfer, Vol. 33, No. 1, pp. 91-103.
-
(1990)
International Journal of Heat and Mass Transfer
, vol.33
, Issue.1
, pp. 91-103
-
-
Tong, W.1
Bar-Cohen, A.2
Simon, T.W.3
You, S.M.4
-
22
-
-
0025209052
-
Experimental Investigation of Nucleate Boiling Incipience With a Highly Wetting Dielectric Fluid (R-113)
-
You, S. M., Simon, T. W., Bai'-Cohen, A., and Tong, W. 1990a, “Experimental Investigation of Nucleate Boiling Incipience With a Highly Wetting Dielectric Fluid (R-113)” International Journal of Heat and Mass Transfer, Vol. 33, No. 1, pp. 105-117.
-
(1990)
International Journal of Heat and Mass Transfer
, vol.33
, Issue.1
, pp. 105-117
-
-
You, S.M.1
Simon, T.W.2
Bai'-Cohen, A.3
Tong, W.4
-
23
-
-
0005947388
-
Experiments on Boiling Incipience With a Highly-Wetting Dielectric Fluid: Effects of Pressure, Subcooling, and Dissolved Gas
-
Hemisphere, Washington, DC
-
You, S. M., Simon, T. W., and Bar-Cohen, A., 1990b, “Experiments on Boiling Incipience With a Highly-Wetting Dielectric Fluid: Effects of Pressure, Subcooling, and Dissolved Gas,” Proceedings of the Ninth International Heat Transfer Conference, Vol. 2, pp. 337-342, Hemisphere, Washington, DC.
-
(1990)
Proceedings of the Ninth International Heat Transfer Conference
, vol.2
, pp. 337-342
-
-
You, S.M.1
Simon, T.W.2
Bar-Cohen, A.3
-
24
-
-
0025557597
-
Experiments on Nucleate Boiling With a Highly-Wetting Dielectric Fluid: Effects of Pressure, Subcooling, and Dissolved Gas Content
-
T. Simon and S. Oktay, eds., ASME HTD
-
You, S. M., Simon, T. W., and Bar-Cohen, A., 1990c, “Experiments on Nucleate Boiling With a Highly-Wetting Dielectric Fluid: Effects of Pressure, Subcooling, and Dissolved Gas Content,” Cryogenic and Immersion Cooling of Optics and Electronic Equipment, T. Simon and S. Oktay, eds., ASME HTD-Vol. 131, pp. 45-52.
-
(1990)
Cryogenic and Immersion Cooling of Optics and Electronic Equipment
, vol.131
, pp. 45-52
-
-
You, S.M.1
Simon, T.W.2
Bar-Cohen, A.3
-
25
-
-
0025751177
-
Reduced Incipience Superheat in Boiling of Fluids Which Hold Dissolved Gas
-
E. Hensel, V. K. Dhir, R. Greif, and J. Fillo, eds., ASME HTD-Vol
-
You, S. M., Simon, T. W., and Bar-Cohen, A., 1991, “Reduced Incipience Superheat in Boiling of Fluids Which Hold Dissolved Gas,” Phase Change Heat Transfer 1991, E. Hensel, V. K. Dhir, R. Greif, and J. Fillo, eds., ASME HTD-Vol. 159.
-
(1991)
Phase Change Heat Transfer 1991
, pp. 159
-
-
You, S.M.1
Simon, T.W.2
Bar-Cohen, A.3
-
26
-
-
0027797809
-
Immersion Cooling of Multichip Module by Pool Boiling of FC-86
-
EEP, ASME New York, NY
-
Zitz„ J. A., Bergles, A. E., 1993, “Immersion Cooling of Multichip Module by Pool Boiling of FC-86,” EEP-Vol. 4-2, Advances in Electronic Packaging, pp. 917-926, ASME New York, NY
-
(1993)
Advances in Electronic Packaging
, vol.4
, Issue.2
, pp. 917-926
-
-
Zitz„, J.A.1
Bergles, A.E.2
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