Numerical prediction of flow and heat transfer in an impingement heat sink

Journal of Electronic Packaging, Transactions of the ASME

Volumn 119, Issue 1, 1997, Pages 58-63

  Sathe, S ^a   Kelkar, K M ^b   Karki, K C ^b   Tai, C ^a   Lamb, C ^a   Patankar, S V ^c  

^a IBM   (United States)

^b Research Inc   (United States)

^c UNIVERSITY OF MINNESOTA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM COPPER ALLOYS; CERAMIC MATERIALS; COMPUTATIONAL METHODS; FINS (HEAT EXCHANGE); FLOW PATTERNS; HEAT FLUX; HEAT LOSSES; HEAT TRANSFER; ITERATIVE METHODS; SUBSTRATES; THERMAL CONDUCTIVITY OF GASES; THERMAL CONDUCTIVITY OF SOLIDS;

COMPUTATIONAL FLOW ANALYSIS; ELECTRONIC COOLING TECHNIQUES;

ELECTRONICS PACKAGING;

EID: 0031098714     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2792201     Document Type: Article

References (6)

1. Chu, R. C., 1986, “Heat Transfer on Electronic Systems,” Proceedings of the 8th International Heat Transfer Conference, San Francisco, CA, pp. 293-305.
2. Nakayama, W., 1988, “Thermal Management of Electronic Equipment,” in Advances in Thermal Modeling of Electronic Components and Systems, Vol. 1, A. Bar Cohen and A. Kraus, eds., Hemisphere, Washington, DC, pp. 1-78.
3. Patankar, S. V., 1980, Numerical Heat Transfer and Fluid Flow, Hemisphere, Washington DC.
4. Stone, H. L., 1968, “Iterative Solution of Implicit Approximations of Multidimensional Partial Differential Equations,” SIAM Journal of Numerical Analysis, Vol. 5, pp. 530-558.
5. Patankar, S. V., 1981, “A Calculation Procedure for Two-Dimensional Elliptic Situations,” Numerical Heat Transfer, Vol. 4, pp. 409-425.
6. Kelkar, K. M., 1990, “Iterative Method for the Numerical Prediction of Heat Transfer in Problems Involving Large Differences in Thermal Conductivities,” Numerical Heat Transfer, Vol. 107, No. 9, pp. 113-128