Influence of magnetic field configuration on the deposition conditions in an unbalanced magnetron system

Surface and Coatings Technology

Volumn 90, Issue 1-2, 1997, Pages 143-149

  Zlatanovic M ^a   Belosevac R ^a   Kunosic A ^a  

^a Faculty of Electrical Engineering

Author keywords

Deposition conditions; Magnetic field configuration; Unbalanced magnetron system

Indexed keywords

ALUMINUM COMPOUNDS; COATINGS; CURRENT DENSITY; CURRENT VOLTAGE CHARACTERISTICS; MAGNETIC FIELD EFFECTS; PLASMA DENSITY; PLATING; SPUTTER DEPOSITION; SUBSTRATES; TITANIUM NITRIDE;

DOUBLE MAGNETRON OPEN FIELD CONFIGURATION; SINGLE MAGNETRON MULTIPOLE CLOSED FIELD CONFIGURATION; SINGLE MAGNETRON MULTIPOLE OPEN FIELD CONFIGURATION;

MAGNETRON SPUTTERING;

EID: 0031097250     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0257-8972(96)03110-6     Document Type: Article

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