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Volumn 8, Issue 3, 1997, Pages 34-36
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Designing a modular chip-scale package assembly line
a
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Author keywords
[No Author keywords available]
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Indexed keywords
APPLICATION SPECIFIC INTEGRATED CIRCUITS;
AUTOMATION;
COMPUTER AIDED MANUFACTURING;
COST EFFECTIVENESS;
ENCAPSULATION;
INTEGRATED CIRCUIT MANUFACTURE;
MASKS;
PLANNING;
PLANT LAYOUT;
RANDOM ACCESS STORAGE;
SOLDERING;
STANDARDIZATION;
CHIP SCALE PACKAGE ASSEMBLY LINE;
DYNAMIC RANDOM ACCESS MEMORY;
INTEGRATED CIRCUIT PACKAGING TECHNOLOGY;
PRODUCTION FLOW;
SOLDER BALLS;
STATIC RANDOM ACCESS MEMORY;
TAPE AUTOMATED BONDED DEVICES;
TRANSPORTABILITY;
ELECTRONICS PACKAGING;
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EID: 0031095913
PISSN: 10540407
EISSN: None
Source Type: Trade Journal
DOI: None Document Type: Article |
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Times cited : (1)
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References (0)
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