On the blister formation in copper alloys due to the helium ion implantation

Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science

Volumn 28, Issue 13, 1997, Pages 755-762

  Moreno, D ^a   Eliezer, D ^b  

^a NUCLEAR RESEARCH CENTER NEGEV   (Israel)

^b BEN GURION UNIVERSITY OF THE NEGEV   (Israel)

Author keywords

[No Author keywords available]

Indexed keywords

BLISTER CAP; BLISTER FORMATION; CIRCULAR DIAPHRAGMS; CIRCULAR PLATES; CLAMPED EDGE; CRYSTALLOGRAPHIC ORIENTATIONS; GAS PRESSURES; HELIUM CONCENTRATIONS; HELIUM ION; IMPLANTATION ENERGIES; IMPLANTED HELIUM; MATHEMATICAL SOLUTIONS; MAXIMUM STRESS; NEAR-SURFACE; NEW APPROACHES; PROJECTED RANGE; STOPPING POWER;

FILM PREPARATION; FILM THICKNESS; HELIUM; ION BOMBARDMENT; ION IMPLANTATION; MULTILAYERS; THIN FILM DEVICES; YIELD STRESS; ATOMS; CRYSTAL ORIENTATION; MATHEMATICAL MODELS; MECHANICAL PROPERTIES; METALLIC FILMS; SURFACE PROPERTIES; THIN FILMS;

MECHANICAL PROPERTIES; COPPER ALLOYS;

BLISTER FORMATION;

EID: 0031095185     PISSN: 10735623     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11661-997-1003-8     Document Type: Article

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