Simple compact diode-laser/microlens packaging

IEEE Journal of Quantum Electronics

Volumn 33, Issue 3, 1997, Pages 457-461

  Liau, Z L ^a   Tsang, D Z ^a,b   Walpole, J N ^a  

^a MASSACHUSETTS INSTITUTE OF TECHNOLOGY   (United States)

^b NZ Applied Technologies   (United States)

Author keywords

Compact optical systems; Diode lasers; Microlenses; Micromechanics; Microoptics; Self aligned integration; Simple packaging

Indexed keywords

ELECTRONICS PACKAGING; HEAT SINKS; LENSES; OPTICAL SYSTEMS; OPTICAL VARIABLES MEASUREMENT; OPTICAL WAVEGUIDES; REFRACTIVE INDEX; SEMICONDUCTING GALLIUM COMPOUNDS; SEMICONDUCTING INDIUM COMPOUNDS; SEMICONDUCTOR DEVICE MANUFACTURE; SUBSTRATES;

INFRARED MICROSCOPES; OPTICAL PATH DIFFERENCE; RIDGE WAVEGUIDE; SPHERICAL MICROLENSES; STREHL-RATIO CALCULATIONS;

SEMICONDUCTOR LASERS;

EID: 0031094418     PISSN: 00189197     EISSN: None     Source Type: Journal    
DOI: 10.1109/3.556015     Document Type: Article

References (11)

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