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Volumn 20, Issue 3, 1997, Pages
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Depositing diffusion barriers
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NONE
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Author keywords
[No Author keywords available]
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Indexed keywords
ALUMINUM ALLOYS;
CHEMICAL VAPOR DEPOSITION;
COPPER;
DIFFUSION;
PRODUCT DESIGN;
TITANIUM;
TITANIUM NITRIDE;
TUNGSTEN;
VAPOR DEPOSITION;
DIFFUSION BARRIER MATERIALS;
PHYSICAL VAPOR DEPOSITION;
SEMICONDUCTOR DEVICE MANUFACTURE;
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EID: 0031094414
PISSN: 01633767
EISSN: None
Source Type: Journal
DOI: None Document Type: Article |
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Times cited : (1)
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References (6)
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