Integration of vapor deposited polyimide into a multichip module packaging process

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Volumn 20, Issue 1, 1997, Pages 13-15

  Liberman, Vladimir ^b   Malba, Vincent ^b   Bernhardt, Anthony F ^a,b  

^a IEEE

^b LAWRENCE LIVERMORE NATIONAL LABORATORY   (United States)

Author keywords

Infrared spectroscopy; Multichip module; Polyimide; Refractive index; Vapor deposition

Indexed keywords

DIELECTRIC MATERIALS; ELECTRIC WIRING; ELECTRONICS PACKAGING; INFRARED SPECTROSCOPY; POLYIMIDES; POLYMERIZATION; PRINTED CIRCUIT BOARDS; PRISMS; REFRACTIVE INDEX; SUBSTRATES; THIN FILMS; VAPOR DEPOSITION;

MULTICHIP MODULE PACKAGING PROCESS; PRISM COUPLING TECHNIQUE; QUARTZ LAMP; VAPOR DEPOSITION POLYMERIZATION;

MULTICHIP MODULES;

EID: 0031076150     PISSN: 10709894     EISSN: None     Source Type: Journal    
DOI: 10.1109/96.554454     Document Type: Article

References (7)

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