Study of metal-polymer adhesion - a new technology: Cu plasma PIB

Journal of Electronic Materials

Volumn 26, Issue 2, 1997, Pages 78-82

  Yang, G R ^a   Shen, H ^a   Li, C ^a   Lu, T M ^a  

^a RENSSELAER POLYTECHNIC INSTITUTE   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL VAPOR DEPOSITION; COPPER; INTERFACES (MATERIALS); MULTICHIP MODULES; POLYMERIZATION; POLYMERS; SECONDARY ION MASS SPECTROMETRY; VLSI CIRCUITS; X RAY PHOTOELECTRON SPECTROSCOPY;

PARYLENE; PLASMA PARTIALLY IONIZED BEAM; VAPOR DEPOSITION POLYMERIZATION;

ADHESION;

EID: 0031075942     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-997-0092-x     Document Type: Article

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