Low cost fabrication of micromechanical systems

Microelectronic Engineering

Volumn 35, Issue 1-4, 1997, Pages 389-392

  Cui, Zheng ^a   Lawes, Ron A ^a  

^a RUTHERFORD APPLETON LABORATORY   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

COATINGS; ELECTROPLATING; FABRICATION; INTEGRATED CIRCUIT MANUFACTURE; METALLIC FILMS; PHOTORESISTS; SEMICONDUCTOR DEVICE STRUCTURES; SUBSTRATES; THIN FILMS;

MASK ALIGNER; MICROMECHANICAL SYSTEMS;

MICROELECTROMECHANICAL DEVICES;

EID: 0031074380     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0167-9317(96)00207-9     Document Type: Article

References (4)

1. B. Löchel, A. Maciossek, M. Knig, H.J. Quenzer and H.-L. Huber, "Galvanoplated 3D Structures for Micro Systems", Microelectronic Engineering 23, p.455 (1994)
2. C. Burbaum, J. Mohr and P. Bley, "Fabrication of capacitive acceleration sensors by the LIGA technique", Sensors and Actuators, A25-A27, p.613 (1991)
3. A.B. Frazier, C.H. Ahn and M.G. Allen, "Development of micromachined devices using polymide-based processes", Sensors and Actuators, A45, p.47 (1994)
4. A. Maciossek, B. Löchel, H. Quenzer, B. Wagner, S. Shulze and J. Noetzel, "Galvanoplating and sacrificial layers for surface micromachining", Microelectronic Engineering 27, p.503 (1995)