Fabrication of submicron single-crystalline and bamboo Al lines by recrystallization

Microelectronic Engineering

Volumn 35, Issue 1-4, 1997, Pages 277-280

  Van Den Homberg, M J C ^a   Alkemade, P F A ^a   Verbruggen, A H ^a   Dirks, A G ^b   Hurd, J L ^c   Radelaar, S ^a  

^a DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

^b PHILIPS RESEARCH LABORATORIES   (Netherlands)

^c IBM   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; CRYSTAL MICROSTRUCTURE; CRYSTALLINE MATERIALS; ELECTRIC CONDUCTIVITY; ELECTROMIGRATION; ELECTRON BEAM LITHOGRAPHY; HEATING; REACTIVE ION ETCHING; RECRYSTALLIZATION (METALLURGY); SINGLE CRYSTALS; SPUTTER DEPOSITION; TRANSMISSION ELECTRON MICROSCOPY;

ALUMINUM LINES; BACKSCATTER KIKUCHI DIFFRACTION;

MICROELECTRONIC PROCESSING;

EID: 0031073873     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0167-9317(96)00110-4     Document Type: Article

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