Scanning probe sharp tip formation for IC integration using mesa technique

Microelectronic Engineering

Volumn 35, Issue 1-4, 1997, Pages 329-332

  Grabiec, P B ^a   Shi, Feng ^b   Hudek, P ^b   Gotszalk, T ^b   Zaborowski, M ^b   Dumania, P ^a   Rangelow, I W ^b  

^a Institute of Electron Technology   (Poland)

^b UNIVERSITY OF KASSEL   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ATOMIC FORCE MICROSCOPY; CHEMICAL VAPOR DEPOSITION; CMOS INTEGRATED CIRCUITS; COATINGS; INTEGRATED CIRCUITS; MICROMACHINING; PHOTORESISTS; PROBES; SEMICONDUCTOR DEVICE STRUCTURES; SILICON NITRIDE; SILICON WAFERS;

LOW PRESSURE CHEMICAL VAPOR DEPOSITION METHOD; PIEZORESISTOR SENSOR;

MICROELECTRONIC PROCESSING;

EID: 0031073202     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0167-9317(96)00136-0     Document Type: Article

References (4)

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3. M. Tortonese, H. Yamada, R.C. Barett, C. F. Quate, IEEE, 91CH2815-5 (1991) 448
4. I. W. Rangelow, Microelectronic Eng., 23 (1994) 369