Smart Substrate MCMs

Journal of Electronic Testing: Theory and Applications (JETTA)

Volumn 10, Issue 1-2, 1997, Pages 39-53

  Gattiker, Anne E ^a,b,c,d,e   Maly, Wojciech ^a,c,e,f,g,h  

^a CARNEGIE MELLON UNIVERSITY   (United States)

^b DARTMOUTH COLLEGE   (United States)

^c CARNEGIE MELLON UNIVERSITY   (United States)

^d Phi Beta Kappa   (United States)

^e IEEE   (United States)

^f Sematech Center of Excellence   (United States)

^g WARSAW UNIVERSITY OF TECHNOLOGY   (Poland)

^h Polish Academy of Sciences   (Belarus)

Author keywords

Cost model; MCM; Smart substrate; Testing

Indexed keywords

COST EFFECTIVENESS; INTEGRATED CIRCUIT TESTING; SUBSTRATES;

KNOWN GOOD DIE (KGD) APPROACH; SMART SUBSTRATE MULTICHIP MODULE SYSTEMS;

MULTICHIP MODULES;

EID: 0031071933     PISSN: 09238174     EISSN: None     Source Type: Journal    
DOI: 10.1023/a:1008218414112     Document Type: Article

References (13)

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13. W. Maly and P. Nigh, "Built-in Current Testing: A Feasibility Study," Proc. of the 1988 ICCAD, Nov. 1988, pp. 340-343.