Bottom anti-reflective coatings for DUV lithography : Determination of optimum thermal process conditions

Microelectronic Engineering

Volumn 35, Issue 1-4, 1997, Pages 221-224

  Schiltz, A ^a   Terpan, J F ^a   Amblard, G ^a   Paniez, P J ^a  

^a ORANGE LABS   (France)

Author keywords

[No Author keywords available]

Indexed keywords

ANTIREFLECTION COATINGS; CHARACTERIZATION; DIFFERENTIAL SCANNING CALORIMETRY; ELLIPSOMETRY; LIGHT ABSORPTION; PHOTORESISTS; REFRACTIVE INDEX; SPECTROMETRY; TEMPERATURE; THERMODYNAMIC STABILITY; THERMOGRAVIMETRIC ANALYSIS; THIN FILMS;

BOTTOM ANTI REFLECTIVE COATING; DEEP ULTRAVIOLET;

PHOTOLITHOGRAPHY;

EID: 0031071844     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0167-9317(96)00087-1     Document Type: Article

References (3)

1. A. Schiltz, J-F. Terpan, S. Brun and P. J. Paniez, Microelectronic Engineering 30, (1996), 283-286
2. T. Lynch, V. Paradis, M. Spak and W. Moreau, Proc. SPIE Vol. 2195, (1994), 225-235.
3. P. J. Paniez, C. Rosilio, B. Mouanda, F. Vinet, Proc. SPIE Vol. 2195, (1994), 14-27.