A new technique for via plugging through the selective chemical vapor deposition of aluminum

Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers

Volumn 36, Issue 2, 1997, Pages 657-660

  Kim, Byung Yoon ^a   Kim, Dong Chan ^a   Joo, Seung Ki ^a  

^a Seoul National University   (South Korea)

Author keywords

Aluminum; CVD; Metallization; Selective plugging; TIBA; Via plugging

Indexed keywords

ALUMINUM INTERCONNECTION LINES; SELECTIVE PLUGGING; TRIISOBUTYLALUMINUM (TIBA);

CHEMICAL VAPOR DEPOSITION; COBALT; METALLIZING; PALLADIUM; SEMICONDUCTOR METAL BOUNDARIES; SPUTTER DEPOSITION; ULTRATHIN FILMS;

ALUMINUM;

EID: 0031069416     PISSN: 00214922     EISSN: None     Source Type: Journal    
DOI: 10.1143/jjap.36.657     Document Type: Article

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