Microlens lithography and smart masks

Microelectronic Engineering

Volumn 35, Issue 1-4, 1997, Pages 513-516

  Volkel R ^a   Herzig, H P ^a   Nussbaum, Ph ^a   Blattner, P ^a   Dandliker R ^a   Cullmann, E ^b   Hugle, W B ^c  

^a IMTNeuchâtel   (Switzerland)

^b Karl Suss KG   (Germany)

^c Hugle Lithography   (Switzerland)

Author keywords

[No Author keywords available]

Indexed keywords

ABERRATIONS; FUSED SILICA; LENSES; MASKS; MICROMACHINING; MULTICHIP MODULES; REACTIVE ION ETCHING; SUBSTRATES;

FIELD EMISSION DISPLAYS; FLAT PANEL DISPLAYS; MICROLENS LITHOGRAPHY;

PHOTOLITHOGRAPHY;

EID: 0031069257     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0167-9317(96)00199-2     Document Type: Article

References (11)

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3. Z. D. Popovic, R. A. Sprague, G. A. Neville-Connell, Technique for the monolithic fabrication of microlens arrays, Appl. Opt. 27, 1281 (1988).
4. Ph. Nussbaum, R. Völkel, H.P. Herzig, R. Dändliker, Micro-optics for sensors, SPIE 2783 (1996).
5. M. Eisner, S. Haselbeck, H. Schreiber, J. Schwider, Reactive ion etching of microlens arrays into fused silica, EOS Top. Meet. Dig. 2, 17-19 (1993).
6. M. Eisner, J. Schwider, Transferring resist microlenses into Si by RIE, accept, for Opt. Eng. (1996).
7. Prof. Schwider, Uni Erlangen, FRG
8. Fujitsu, San Jose, USA
9. Karl Suss KG, Munich, FRG
10. Philips Components, Eindhoven, NL
11. ) J. T. Winthrop and C. R. Worthington, Theory of Fresnel images: I, JOSA 55, 373-381 (1965).