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Volumn 40, Issue 2, 1997, Pages 493-498

Composite correlations for convective heat transfer from arrays of three-dimensional obstacles

Author keywords

[No Author keywords available]

Indexed keywords

CHANNEL FLOW; CORRELATION METHODS; HEAT TRANSFER COEFFICIENTS;

EID: 0031025110     PISSN: 00179310     EISSN: None     Source Type: Journal    
DOI: 10.1016/0017-9310(96)00088-9     Document Type: Article
Times cited : (16)

References (11)
  • 1
    • 0026836709 scopus 로고
    • The adiabatic heat transfer coefficient and the superposition kernel function - I. Data from arrays of flatpacks for different flow conditions
    • A. M. Anderson and R. J. Moffat, The adiabatic heat transfer coefficient and the superposition kernel function - I. Data from arrays of flatpacks for different flow conditions, J. Electron. Packaging 114, 14-21 (1992).
    • (1992) J. Electron. Packaging , vol.114 , pp. 14-21
    • Anderson, A.M.1    Moffat, R.J.2
  • 2
    • 0012093015 scopus 로고
    • The use of superposition in calculating cooling requirements for circuit board mounted electronic components
    • San Diego
    • D. E. Arvizu and R. J. Moffat, The use of superposition in calculating cooling requirements for circuit board mounted electronic components, Proc. 32nd Electronic Components Conf., San Diego, pp. 133-144 (1982).
    • (1982) Proc. 32nd Electronic Components Conf. , pp. 133-144
    • Arvizu, D.E.1    Moffat, R.J.2
  • 3
    • 0028404446 scopus 로고
    • The thermal wake function for rectangular electronic modules
    • S. S. Kang, The thermal wake function for rectangular electronic modules, J. Electron. Packaging 116, 55-59 (1994).
    • (1994) J. Electron. Packaging , vol.116 , pp. 55-59
    • Kang, S.S.1
  • 4
    • 0026116907 scopus 로고
    • Forced convection air cooling of simulated low profile electronic components -I. Base case
    • G. L. Lehmann and J. Pembroke, Forced convection air cooling of simulated low profile electronic components -I. Base case, J. Electron. Packaging 113, 21-26 (1991).
    • (1991) J. Electron. Packaging , vol.113 , pp. 21-26
    • Lehmann, G.L.1    Pembroke, J.2
  • 5
    • 0021542641 scopus 로고
    • Heat transfer from arrays of flat packs in channel flow
    • Baltimore, Maryland
    • R. A. Wirtz and P. Dykshoorn, Heat transfer from arrays of flat packs in channel flow, Proc. Int. Electronics Packaging Conf., Baltimore, Maryland, pp. 318-326 (1984).
    • (1984) Proc. Int. Electronics Packaging Conf. , pp. 318-326
    • Wirtz, R.A.1    Dykshoorn, P.2
  • 6
    • 0029356441 scopus 로고
    • Heat transfer enhancement in narrow channels using two- And three-dimensional mixing devices
    • S. V. Garimella and D. J. Schlitz, Heat transfer enhancement in narrow channels using two- and three-dimensional mixing devices, J. Heat Transfer 117, 590-596 (1995).
    • (1995) J. Heat Transfer , vol.117 , pp. 590-596
    • Garimella, S.V.1    Schlitz, D.J.2
  • 7
    • 0025658760 scopus 로고
    • Heat transfer characteristics from an array of protruding elements in single phase forced convection
    • S. V. Garimella and P. A. Eibeck, Heat transfer characteristics from an array of protruding elements in single phase forced convection, Int. J. Heat Mass Transfer 33, 2659-2669 (1990).
    • (1990) Int. J. Heat Mass Transfer , vol.33 , pp. 2659-2669
    • Garimella, S.V.1    Eibeck, P.A.2
  • 8
    • 17644446461 scopus 로고
    • The adiabatic heat transfer coefficient on the faces of a cube in an electronics cooling situation
    • J. Rhee, C. J. Danek and R. J. Moffat, The adiabatic heat transfer coefficient on the faces of a cube in an electronics cooling situation, ASME Adv. Electron. Packaging 2, 619-629 (1993).
    • (1993) ASME Adv. Electron. Packaging , vol.2 , pp. 619-629
    • Rhee, J.1    Danek, C.J.2    Moffat, R.J.3
  • 10
    • 85012688998 scopus 로고
    • Heat transfer and pressure drop of liquids in tubes
    • E. N. Sieder and C. E. Tate, Heat transfer and pressure drop of liquids in tubes, Ind. Engng Chem. 28, 1429 (1936).
    • (1936) Ind. Engng Chem. , vol.28 , pp. 1429
    • Sieder, E.N.1    Tate, C.E.2
  • 11
    • 0003355934 scopus 로고
    • Enhancement of single-phase heat transfer
    • (Edited by S. Kakac, R. K. Shah and W. Aung), Chap. 17, Wiley, New York
    • R. L. Webb, Enhancement of single-phase heat transfer. In Handbook of Single-Phase Convective Heat Transfer (Edited by S. Kakac, R. K. Shah and W. Aung), Chap. 17, p. 17.51, Wiley, New York (1987).
    • (1987) Handbook of Single-Phase Convective Heat Transfer , pp. 1751
    • Webb, R.L.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.