메뉴 건너뛰기




Volumn 37, Issue 1, 1997, Pages 19-37

Scaling down and reliability problems of Gigabit CMOS circuits

Author keywords

[No Author keywords available]

Indexed keywords

CRYSTAL DEFECTS; DEPOSITION; DIELECTRIC MATERIALS; ELECTRIC FIELDS; ELECTRIC RESISTANCE; ELECTRIC WIRING; ELECTROMIGRATION; GATES (TRANSISTOR); MOSFET DEVICES; RANDOM ACCESS STORAGE; RELIABILITY; STRESSES;

EID: 0030871507     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/0026-2714(96)00236-3     Document Type: Review
Times cited : (37)

References (84)
  • 1
    • 0041651668 scopus 로고
    • Process of the future
    • Febr.
    • Process of the future, Solid State Techn., p. 42, (Febr. 1995).
    • (1995) Solid State Techn. , pp. 42
  • 11
    • 0029484255 scopus 로고
    • A symmetric 0.25μm CMOS technology for low-power, high performance ASIC applications using 248nm DUV lithography
    • Dig. Techn. Pap.
    • D.M Boulin, W.M. Mansfield et al. and T. Itani, T. Tounai et al, A symmetric 0.25μm CMOS technology for low-power, high performance ASIC applications using 248nm DUV lithography, Symp. VLSI Techn., Dig. Techn. Pap., p. 65 (1995).
    • (1995) Symp. VLSI Techn. , pp. 65
    • Boulin, D.M.1    Mansfield, W.M.2    Itani, T.3    Tounai, T.4
  • 12
    • 0028754970 scopus 로고
    • Low threshold voltage CMOS devices with smooth topography for 1 Volt application
    • D C.H. Yu, H.D. Lin, C McAndrew and K.H Lee. Low threshold voltage CMOS devices with smooth topography for 1 Volt application, IEDM Dig. Techn. Pap. p. 489 (1994).
    • (1994) IEDM Dig. Techn. Pap. , pp. 489
    • Yu, D.C.H.1    Lin, H.D.2    McAndrew, C.3    Lee, K.H.4
  • 13
    • 0019608286 scopus 로고
    • Technology challenges for ultrasmall silicon MOSFET's
    • R H. Dennard, Technology challenges for ultrasmall silicon MOSFET's, J. Vac. Sci. Tech., 19, 537 (1981).
    • (1981) J. Vac. Sci. Tech. , vol.19 , pp. 537
    • Dennard, R.H.1
  • 14
    • 0027578886 scopus 로고
    • Influence of statistical dopant fluctuations on MOS transistors with deep submicron channel length
    • T. Mikolaijick and H. Ryssel, Influence of statistical dopant fluctuations on MOS transistors with deep submicron channel length, Microelectronic Engin., 21, 419 (1993).
    • (1993) Microelectronic Engin. , vol.21 , pp. 419
    • Mikolaijick, T.1    Ryssel, H.2
  • 15
    • 0027813761 scopus 로고
    • Three-dimensional "Atomistic" simulation of discrete random dopant distribution effects in sub-0.1μm MOSFET's
    • H.-S. Wong and Y. Taur, Three-dimensional "atomistic" simulation of discrete random dopant distribution effects in sub-0.1μm MOSFET's, IEDM, Dig. Techn. Pap., p. 705 (1993).
    • (1993) IEDM, Dig. Techn. Pap. , pp. 705
    • Wong, H.-S.1    Taur, Y.2
  • 16
    • 0028459988 scopus 로고
    • MOSFET scaling in the next decade and beyond
    • June
    • C. Hu, MOSFET scaling in the next decade and beyond, Semic Intern., p.105 (June 1994).
    • (1994) Semic Intern. , pp. 105
    • Hu, C.1
  • 17
    • 84941504025 scopus 로고
    • Electrical breakdown in thin gate and tunneling oxides
    • L.C Chen, S.E. Holland and C. Hu, Electrical breakdown in thin gate and tunneling oxides, IEEE Trans. Electr. Dev., 32, 413 (1985).
    • (1985) IEEE Trans. Electr. Dev. , vol.32 , pp. 413
    • Chen, L.C.1    Holland, S.E.2    Hu, C.3
  • 21
    • 0029212368 scopus 로고
    • The relation between oxide degradation and oxide breakdown
    • C. Felsch and E. Rosenbaum, The relation between oxide degradation and oxide breakdown, Proc. Int. Rel. Phy. Symp., p. 142 (1995).
    • (1995) Proc. Int. Rel. Phy. Symp. , pp. 142
    • Felsch, C.1    Rosenbaum, E.2
  • 22
    • 0029515649 scopus 로고
    • Extending gate dielectric scaling limit by use of nitride or oxynitride
    • Dig. Techn. Pap.
    • X.W. Wang, Y. Shi, and T.P. Ma, Extending gate dielectric scaling limit by use of nitride or oxynitride, Symp. VLSI Techn., Dig. Techn. Pap., p. 109 (1995).
    • (1995) Symp. VLSI Techn. , pp. 109
    • Wang, X.W.1    Shi, Y.2    Ma, T.P.3
  • 25
    • 84949585169 scopus 로고
    • Ultra-thin silicon dioxide leakage current and scaling limit
    • Dig. Techn. Pap.
    • K.F. Schuegraf, C.C. King and C. Hu, Ultra-thin silicon dioxide leakage current and scaling limit, Symp. VLSI Techn., Dig. Techn. Pap., p. 18 (1992).
    • (1992) Symp. VLSI Techn. , pp. 18
    • Schuegraf, K.F.1    King, C.C.2    Hu, C.3
  • 29
    • 0024057331 scopus 로고
    • Stress voltage polarity dependence of thermally grown thin gate oxide wearout
    • Y Hokari, Stress voltage polarity dependence of thermally grown thin gate oxide wearout. IEEE Trans. Electr. Dev., 88, 1299 (1988).
    • (1988) IEEE Trans. Electr. Dev. , vol.88 , pp. 1299
    • Hokari, Y.1
  • 30
    • 0028745792 scopus 로고
    • Efficient gate oxide defect screen for VLSI reliability
    • J.C. King, W.Y. Chan and C. Hu, Efficient gate oxide defect screen for VLSI reliability, IEDM Dig. Techn. Pap., p. 597 (1994).
    • (1994) IEDM Dig. Techn. Pap. , pp. 597
    • King, J.C.1    Chan, W.Y.2    Hu, C.3
  • 32
    • 0029483744 scopus 로고
    • Impact of the reduction of the gate to drain capacitance on low voltage operated CMOS devices
    • Dig. Techn. Pap.
    • K. Yamashita, H Nakaoka, K. Kurimoto, H Umimoto and S Odanaka, Impact of the reduction of the gate to drain capacitance on low voltage operated CMOS devices, Symp. VLSI Techn., Dig. Techn. Pap., p. 69 (1995).
    • (1995) Symp. VLSI Techn. , pp. 69
    • Yamashita, K.1    Nakaoka, H.2    Kurimoto, K.3    Umimoto, H.4    Odanaka, S.5
  • 33
    • 0022957464 scopus 로고
    • Mechanical stress and hydrogen effects on hot carrier injection
    • J Mitsuhashi, S. Nakao and T Matsukawa, Mechanical stress and hydrogen effects on hot carrier injection, IEDM Dig. Techn. Pap., p. 386 (1986).
    • (1986) IEDM Dig. Techn. Pap. , pp. 386
    • Mitsuhashi, J.1    Nakao, S.2    Matsukawa, T.3
  • 35
    • 0026154031 scopus 로고
    • Influence of MOSFET I-V characteristics on switching delay time of CMOS inverters after hot carrier stress
    • Q. Wang, W H. Krautschneider, W Weber and D. Schmitt-Landsiedel, Influence of MOSFET I-V characteristics on switching delay time of CMOS inverters after hot carrier stress, IEEE Electr. Dev. Lett., 12, 238 (1991).
    • (1991) IEEE Electr. Dev. Lett. , vol.12 , pp. 238
    • Wang, Q.1    Krautschneider, W.H.2    Weber, W.3    Schmitt-Landsiedel, D.4
  • 36
    • 0025578296 scopus 로고
    • Roles of oxide trapped charge and generated interface states on GIDL under hot-carrier stressing
    • G. Lo and D. Kwong, Roles of oxide trapped charge and generated interface states on GIDL under hot-carrier stressing, IEDM Dig. Techn. Pap., p. 557 (1990).
    • (1990) IEDM Dig. Techn. Pap. , pp. 557
    • Lo, G.1    Kwong, D.2
  • 38
    • 0028758515 scopus 로고
    • Interface trap induced thermionic and field emission current in off-state MOSFET's
    • T. Wang, T. Chang and C. Huang, Interface trap induced thermionic and field emission current in off-state MOSFET's, IEDM Dig. Techn. Pap., p. 161 (1994).
    • (1994) IEDM Dig. Techn. Pap. , pp. 161
    • Wang, T.1    Chang, T.2    Huang, C.3
  • 39
    • 0018547168 scopus 로고
    • Modeling diffusion and collection of charge from ionizing radiation in silicon devices
    • S. Kirkpatrick. Modeling diffusion and collection of charge from ionizing radiation in silicon devices, IEEE Trans. Electron Dev., 26, 1742 (1979).
    • (1979) IEEE Trans. Electron Dev. , vol.26 , pp. 1742
    • Kirkpatrick, S.1
  • 40
    • 0017910257 scopus 로고
    • A new physical mechanism for soft errors in dynamic memories
    • T C. May and M.H. Woods. A new physical mechanism for soft errors in dynamic memories, Proc. Intern. Rel. Symp., p. 33 (1978).
    • (1978) Proc. Intern. Rel. Symp. , pp. 33
    • May, T.C.1    Woods, M.H.2
  • 42
    • 0020091827 scopus 로고
    • Alpha-particle-induced field and enhanced collection of carriers
    • C. Hu, Alpha-particle-induced field and enhanced collection of carriers, IEEE Electr. Dev. Lett, 3, 31 (1982).
    • (1982) IEEE Electr. Dev. Lett , vol.3 , pp. 31
    • Hu, C.1
  • 45
    • 0021197246 scopus 로고
    • A computer analysis on the collection of alpha-generated charge for reflecting and absorbing surface conditions around the collector
    • K. Terrill, C. Hu and A. Neureuther, A computer analysis on the collection of alpha-generated charge for reflecting and absorbing surface conditions around the collector, Solid-State Electron., 27, 42 (1984).
    • (1984) Solid-State Electron. , vol.27 , pp. 42
    • Terrill, K.1    Hu, C.2    Neureuther, A.3
  • 46
    • 0026834350 scopus 로고
    • Building-in reliability Soft errors - A case study
    • Z. Hasnain and A. Ditali. Building-in reliability Soft errors - a case study, Proc. Int. Rel. Phys. Symp., p. 276 (1992).
    • (1992) Proc. Int. Rel. Phys. Symp. , pp. 276
    • Hasnain, Z.1    Ditali, A.2
  • 47
    • 0019577364 scopus 로고
    • The effect of sea level cosmic rays on electron devices
    • J.F. Ziegler and W.A Lanford, The effect of sea level cosmic rays on electron devices, J. Appl. Phys., 52, 4305 (1981).
    • (1981) J. Appl. Phys. , vol.52 , pp. 4305
    • Ziegler, J.F.1    Lanford, W.A.2
  • 48
    • 0020835052 scopus 로고
    • Cosmic ray interactions with boron: A possible source of soft errors
    • R.F. Fleischer, Cosmic ray interactions with boron: A possible source of soft errors, IEEE Trans. Nucl. Sci., 30, 4013 (1983).
    • (1983) IEEE Trans. Nucl. Sci. , vol.30 , pp. 4013
    • Fleischer, R.F.1
  • 49
    • 0029222559 scopus 로고
    • Boron compounds as a dominant source of alpha particles in semiconductor devices
    • R. Baumann, T Hossain, S Murata and H. Kitagawa, Boron compounds as a dominant source of alpha particles in semiconductor devices, Proc. Int. Rel. Phys. Symp., p. 297 (1995).
    • (1995) Proc. Int. Rel. Phys. Symp. , pp. 297
    • Baumann, R.1    Hossain, T.2    Murata, S.3    Kitagawa, H.4
  • 53
    • 0027702157 scopus 로고
    • Influence of the series resistance of onchip power supply buses on internal device failure after ESD stress
    • H Terletzki, W. Nikutta and W. Reczek, Influence of the series resistance of onchip power supply buses on internal device failure after ESD stress, IEEE Trans. Elec. Dev., 40, 2081 (1993).
    • (1993) IEEE Trans. Elec. Dev. , vol.40 , pp. 2081
    • Terletzki, H.1    Nikutta, W.2    Reczek, W.3
  • 54
    • 0029476615 scopus 로고
    • Novel clamp circuits for IC power supply protection
    • T J. Maloney and S. Dabral. Novel clamp circuits for IC power supply protection. Proc. EOS/ESD Symp., p. 1 (1995).
    • (1995) Proc. EOS/ESD Symp. , pp. 1
    • Maloney, T.J.1    Dabral, S.2
  • 55
    • 0029477105 scopus 로고
    • Analysis of snubber-clamped diode-string mixed voltage interface ESD protection network for advanced microprocessors
    • S H. Voldman, G. Gerosa, V. P. Gross, N. Dickson, S. Furkay and J. Slinkman, Analysis of snubber-clamped diode-string mixed voltage interface ESD protection network for advanced microprocessors, Proc. EOS/ESD Symp., p. 43 (1995).
    • (1995) Proc. EOS/ESD Symp. , pp. 43
    • Voldman, S.H.1    Gerosa, G.2    Gross, V.P.3    Dickson, N.4    Furkay, S.5    Slinkman, J.6
  • 56
    • 0028732943 scopus 로고
    • The impact of technology scaling on ESD robustness and protection circuit design
    • A. Amerasekera and C Duvvury The impact of technology scaling on ESD robustness and protection circuit design, Proc. EOS/ESD Symp., p. 237 (1994).
    • (1994) Proc. EOS/ESD Symp. , pp. 237
    • Amerasekera, A.1    Duvvury, C.2
  • 58
    • 0042152541 scopus 로고
    • A successful HBM ESD protection circuit for micron and sub-micron level CMOS
    • B. G. Carbajal III, R. A. Cline and B H. Andresen, A successful HBM ESD protection circuit for micron and sub-micron level CMOS, Proc. EOS/ESD Symp., p.234 (1992).
    • (1992) Proc. EOS/ESD Symp. , pp. 234
    • Carbajal B.G. III1    Cline, R.A.2    Andresen, B.H.3
  • 59
    • 0042152538 scopus 로고
    • An investigation of BiCMOS ESD protection circuit elements and applications in submicron technologies
    • A. Amerasekera and A Chatterjee, An investigation of BiCMOS ESD protection circuit elements and applications in submicron technologies, Proc. EOS/ESD Symp., p. 265 (1992).
    • (1992) Proc. EOS/ESD Symp. , pp. 265
    • Amerasekera, A.1    Chatterjee, A.2
  • 60
    • 0025953251 scopus 로고
    • A low-voltage triggering SCR for on-chip ESD protection at output and input pads
    • A. Chatterjee and T. Polgreen, A low-voltage triggering SCR for on-chip ESD protection at output and input pads, IEEE Elec. Dev. Lett., EDL-12, 21 (1991).
    • (1991) IEEE Elec. Dev. Lett. , vol.EDL-12 , pp. 21
    • Chatterjee, A.1    Polgreen, T.2
  • 63
    • 0011159445 scopus 로고
    • Process and design optimization for advanced CMOS I/O ESD protection devices
    • S. Daniel and G. Krieger. Process and design optimization for advanced CMOS I/O ESD protection devices, Proc. EOS/ESD Symp., p. 206 (1990).
    • (1990) Proc. EOS/ESD Symp. , pp. 206
    • Daniel, S.1    Krieger, G.2
  • 64
    • 0026820351 scopus 로고
    • Improving the ESD Failure threshold of silicided nMOS output transistors by ensuring uniform current flow
    • T. Polgreen and A. Chatterjee, Improving the ESD Failure threshold of silicided nMOS output transistors by ensuring uniform current flow, IEEE Trans. Elec. Dev., ED-39, p. 379 (1992).
    • (1992) IEEE Trans. Elec. Dev. , vol.ED-39 , pp. 379
    • Polgreen, T.1    Chatterjee, A.2
  • 65
    • 0029506125 scopus 로고
    • Advanced CMOS protection device trigger mechanisms during CDM
    • C. Duvvury and A. Amerasekera. Advanced CMOS protection device trigger mechanisms during CDM, Proc. EOS/ESD Symp., p. 162 (1995).
    • (1995) Proc. EOS/ESD Symp. , pp. 162
    • Duvvury, C.1    Amerasekera, A.2
  • 67
    • 0000177674 scopus 로고
    • ESD protection in a 3.3V sub-micron silicided CMOS technology
    • D. Krakauer and K. Mistry, ESD protection in a 3.3V sub-micron silicided CMOS technology, Proc. EOS/ESD Symp., p.250 (1992).
    • (1992) Proc. EOS/ESD Symp. , pp. 250
    • Krakauer, D.1    Mistry, K.2
  • 70
    • 85033100231 scopus 로고
    • Electromigration, Still a Problem in 2000?
    • March 30-31, 1995, Limburg University, Diepenbeek, Belgium, Book of Abstracts
    • J. Lloyd, Electromigration, Still a Problem in 2000?, Workshop on The Early Resistance Change Technique; March 30-31, 1995, Limburg University, Diepenbeek, Belgium, Book of Abstracts (1995).
    • (1995) Workshop on the Early Resistance Change Technique
    • Lloyd, J.1
  • 72
    • 0027543387 scopus 로고
    • A 1/4 micron interconnection technology using a TiN/Al-Si-Cu/TiN/Al-Si-Cu/TiN/Ti multilayer structure
    • T. Kikkawa, H Aoki, E. Ikawa and J.M. Dryman, A 1/4 micron interconnection technology using a TiN/Al-Si-Cu/TiN/Al-Si-Cu/TiN/Ti multilayer structure, IEEE Trans. Electr. Dev., 40, 296 (1993).
    • (1993) IEEE Trans. Electr. Dev. , vol.40 , pp. 296
    • Kikkawa, T.1    Aoki, H.2    Ikawa, E.3    Dryman, J.M.4
  • 75
    • 85056552457 scopus 로고
    • Dual damascene: A ULSI wiring technology
    • Santa Clara
    • C. W. Kaanta et al., Dual damascene: A ULSI wiring technology, Proc. 8th VMIC, Santa Clara, p. 144 (1991).
    • (1991) Proc. 8th VMIC , pp. 144
    • Kaanta, C.W.1
  • 76
    • 0043154494 scopus 로고
    • Damascene of hard and soft layers for multilevel metallization of ULSI circuits
    • R.V. Joshi, Damascene of hard and soft layers for multilevel metallization of ULSI circuits, Ext. Abstr. Int. Conf. Solid State Dev. Mat., p. 164 (1993).
    • (1993) Ext. Abstr. Int. Conf. Solid State Dev. Mat. , pp. 164
    • Joshi, R.V.1
  • 81
    • 0041651662 scopus 로고
    • Cu Metallization
    • MRS Bulletin, Special Issue on Cu Metallization (1994).
    • (1994) MRS Bulletin , Issue.SPEC. ISSUE
  • 82
    • 0042653637 scopus 로고
    • Evaluation of copper metallization process and its effect on the electrical characteristics of copper-interconnected quarter-micron CMOS
    • Santa Clara
    • N. Awaya, H. Inokawa, Y. Arita, Y. Ozazaki, M. Miyaze, E. Yamamoto, and T. Kobayashi, Evaluation of copper metallization process and its effect on the electrical characteristics of copper-interconnected quarter-micron CMOS, Proc. 12th VMIC, Santa Clara, p. 17 (1995).
    • (1995) Proc. 12th VMIC , pp. 17
    • Awaya, N.1    Inokawa, H.2    Arita, Y.3    Ozazaki, Y.4    Miyaze, M.5    Yamamoto, E.6    Kobayashi, T.7
  • 83
    • 0028271292 scopus 로고
    • Electromigration after stress-induced migration test in quarter-micron Al interconnects
    • K. Hoshino, K. Koyama, and Y. Sugano, Electromigration after stress-induced migration test in quarter-micron Al interconnects, Proc. Int. Rel. Phys. Symp., p. 252 (1994).
    • (1994) Proc. Int. Rel. Phys. Symp. , pp. 252
    • Hoshino, K.1    Koyama, K.2    Sugano, Y.3
  • 84
    • 0028263294 scopus 로고
    • Accurate, non-time-intensive evaluation of the stress-migration endurance for layered Al interconnects
    • N. Matsunaga and H. Shifata, Accurate, non-time-intensive evaluation of the stress-migration endurance for layered Al interconnects, Proc. Int. Rel. Phys. Symp. p. 256 (1994).
    • (1994) Proc. Int. Rel. Phys. Symp. , pp. 256
    • Matsunaga, N.1    Shifata, H.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.