Design and analysis of thermal management for high-power-density converters in sealed enclosures

Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC

Volumn 1, Issue , 1997, Pages 405-412

  Zhang, Michael T ^a   Jovanovic, Milan M ^a   Lee, Fred C ^a  

^a VIRGINIA POLYTECHNIC INSTITUTE AND STATE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTATIONAL FLUID DYNAMICS; COMPUTER SIMULATION; ELECTRIC NETWORK ANALYSIS; ELECTRONICS PACKAGING; OPTIMIZATION; RELIABILITY; THERMAL EFFECTS;

HIGH POWER DENSITY CONVERTERS; THERMAL MANAGEMENT;

POWER CONVERTERS;

EID: 0030865470     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)