Analyses of delamination arrest effect of dimples on interface in LSI package

JSME International Journal, Series A: Mechanics and Material Engineering

Volumn 40, Issue 1, 1997, Pages 58-64

  Sato, Mitsuru ^a   Yoshioka, Sumio ^a   Inoue, Akio ^a   Tani, Shuichi ^a   Iwaoka, Makoto ^a  

^a MITSUBISHI ELECTRIC CORPORATION   (Japan)

Author keywords

Boundary Element Method; Contact Problem; Delamination; Dimple; Interface Crack; LSI Package; Stress Intensity Factor; Structural Analysis; Thermal Stress

Indexed keywords

BOUNDARY ELEMENT METHOD; CALCULATIONS; CRACKS; ELECTRONICS PACKAGING; INTERFACES (MATERIALS); LSI CIRCUITS; PLASTICS APPLICATIONS; PRESSURE EFFECTS; STRESS INTENSITY FACTORS; THERMAL STRESS;

DIMPLE; STEAM PRESSURE LOAD; THERMAL PRESSURE LOAD;

DELAMINATION;

EID: 0030855586     PISSN: 13408046     EISSN: None     Source Type: Journal    
DOI: 10.1299/jsmea1993.40.1_58     Document Type: Article

References (6)

1. Kitano, M., Nishimura, A. and Kawai, S., A Study of Package Cracking during the Reflow Soldering Process (2nd Report, Strength Evaluation of the Plastic by Using Stress Singularity Theory), Trans. Jpn. Soc. Mech. Eng., (in Japanese), Vol. 57, No. 538, A (1991), p. 1398.
2. Omi, S., Fujita, K., Tsuda, T. and Maeda, T., Causes of Cracks in SMD and Type Specific Remedies, IEEE Trans, on Composites, Hybrids and Manufacturing Technology, Vol. 14, No. 4 (1991), p. 818.
3. Nakagawa, O., Ueda, T. and Akiyama, T., Nikkei Microdevices (in Japanese), June edition (1990), p. 58.
4. Sato, M., Yoshioka, S. and Yuuki, R., Boundary Element Heat Conduction and Thermoelastic Analyses of Interface Crack in LSI Package in Consideration of Contact Between Crack Surface, Trans. Jpn. Soc. Mech. Eng., (in Japanese), Vol. 58, No. 550, A (1992), p. 859.
5. Yuuki, R. and Cho, S.B., Boundary Element Analysis of Stress Intensity Factors for An Interface Crack in Dissimilar Materials, Trans. Jpn. Soc. Mech. Eng., (in Japanese), Vol. 55, No. 510, A (1989), p. 340.
6. Yuuki, R. and Kisu, H., Elasticity analysis by boundary element method (in Japanese), (1987), p. 198, Baifu-kan.