Injection moulding, 'C-MOLD' CAE package, process parameter design and quality function deployment: A case study of intelligent materials processing

Journal of Materials Processing Technology

Volumn 63, Issue 1-3, 1997, Pages 481-487

  Yeung, V W S ^a   Lau, K H ^a  

^a HONG KONG POLYTECHNIC UNIVERSITY   (Hong Kong)

Author keywords

CAE; Injection mould design; Material processing; Quality function deployment; Taguchi's parameter design

Indexed keywords

COMPUTER AIDED DESIGN; COMPUTER AIDED ENGINEERING; COMPUTER SOFTWARE; CRACK INITIATION; DEFECTS; FAILURE (MECHANICAL); INTELLIGENT MATERIALS; OPTIMIZATION; PLASTIC PRODUCTS; QUALITY CONTROL; SHRINKAGE; THERMAL STRESS;

INTELLIGENT MATERIALS PROCESSING; PROCESS PARAMETER DESIGN; QUALITY FUNCTION DEPLOYMENT; SIMULATION PACKAGE C-MOLD;

INJECTION MOLDING;

EID: 0030834654     PISSN: 09240136     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0924-0136(96)02669-6     Document Type: Article

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