Temperature during seed filling and soybean seed germination and vigour

Seed Science and Technology

Volumn 25, Issue 2, 1997, Pages 233-244

  Spears, J F ^a   Tekrony, D M ^b   Egli, D B ^b  

^a NORTH CAROLINA STATE UNIVERSITY   (United States)

^b UNIVERSITY OF KENTUCKY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0030827367     PISSN: 02510952     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (28)

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