Multiobjective optimization of component placement on planar printed wiring boards

Annual IEEE Semiconductor Thermal Measurement and Management Symposium

Volumn , Issue , 1997, Pages 92-105

  Queipo, Nestor V ^a   Gil, Guy F ^a  

^a UNIVERSIDAD DEL ZULIA   (Venezuela)

Author keywords

[No Author keywords available]

Indexed keywords

GENETIC ALGORITHMS; HEAT CONDUCTION; HEAT CONVECTION; OPTIMIZATION; PRINTED CIRCUIT BOARDS; TEMPERATURE DISTRIBUTION;

MULTIATTRIBUTE UTILITY ANALYSIS; PARETO OPTIMIZATION;

ELECTRONICS PACKAGING;

EID: 0030826019     PISSN: 10652221     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (25)