CAD tools for area-distributed I/O pad packaging

Proceedings of the IEEE Multi-Chip Module Conference

Volumn , Issue , 1997, Pages

  Farbarik, Ray ^a   Liu, Xiaowen ^a   Rossman, Mark ^a   Parakh, Phiroze ^a   Basso, Todd ^a   Brown, Richard ^a  

^a Cascade Design Automation   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BUFFER CIRCUITS; COMPUTER AIDED SOFTWARE ENGINEERING; ELECTRONICS PACKAGING; FLIP CHIP DEVICES; INTEGRATED CIRCUIT LAYOUT; MICROPROCESSOR CHIPS; THERMAL CONDUCTIVITY;

AREA DISTRIBUTED INPUT OUTPUT PADS; AREA INTERCONNECTED INTEGRATED CIRCUITS; POWER DISTRIBUTION;

COMPUTER AIDED DESIGN;

EID: 0030781420     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Review

References (12)