High power multichip modules employing the planar embedding technique and microchannel water heat sinks

Annual IEEE Semiconductor Thermal Measurement and Management Symposium

Volumn , Issue , 1997, Pages 49-56

  Hahn, R ^a   Kamp, A ^a   Ginolas, A ^a   Schmidt, M ^a   Wolf, J ^a   Glaw, V ^a   Toepper, M ^a   Ehrmann, O ^a   Reichl, H ^a  

^a FRAUNHOFER IZM   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; FLIP CHIP DEVICES; HEAT RESISTANCE; HEAT SINKS; HEAT TRANSFER COEFFICIENTS; MULTICHIP MODULES; PRESSURE DROP; TEMPERATURE DISTRIBUTION; THERMAL CONDUCTIVITY;

PLANAR EMBEDDING TECHNOLOGY; THERMOTEST MODULE; WATER FLUX;

ELECTRONICS PACKAGING;

EID: 0030737237     PISSN: 10652221     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)