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Polymers for Advanced Technologies

Volumn 8, Issue 1, 1997, Pages 1-7

Compressive mechanical properties of the nomex/thermoset honeycomb cores

(2) Kim, Dae Su a Lee, Jae Rock b

a Chungbuk National University (South Korea)

b Korea Research Institute of Chemical Technology (South Korea)

Author keywords

Cure kinetics; Epoxy; Honeycombs; Mechanical properties; Resol

Indexed keywords

ADHESIVES; BONDING; CURING; DENSITY (SPECIFIC GRAVITY); DIFFERENTIAL SCANNING CALORIMETRY; EPOXY RESINS; EXPANSION; HONEYCOMB STRUCTURES; IMPREGNATION; MECHANICAL PROPERTIES; REACTION KINETICS; THERMOSETS;

ADHESIVE BLEND; COMPRESSIVE MECHANICAL PROPERTIES; EPOXY BASED ADHESIVE SYSTEM; HEXAGONAL CELL SHAPE; NOMEX THERMOSET HONEYCOMB CORES; RESOL;

COMPOSITE STRUCTURES;

EID: 0030736662 PISSN: 10427147 EISSN: None Source Type: Journal
DOI: 10.1002/(SICI)1099-1581(199701)8:1<1::AID-PAT601>3.0.CO;2-G Document Type: Article

Times cited : (20)

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