Toward a building-in reliability approach

Microelectronics Reliability

Volumn 37, Issue 1, 1997, Pages 3-18

  Schafft, Harry A ^a   Erhart, David L ^b   Gladden, Warren K ^c  

^a NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY   (United States)

^b MOTOROLA INC   (United States)

^c ADVANCED MICRO DEVICES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

PRODUCT DESIGN; RELIABILITY;

BUILDING IN RELIABILITY (BIR) APPROACH; LIFE TESTING; TESTING IN RELIABILITY (TIR) APPROACH;

SEMICONDUCTOR DEVICE TESTING;

EID: 0030736475     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/0026-2714(96)00235-1     Document Type: Review

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