Thermal testing methods to increase system reliability

Annual IEEE Semiconductor Thermal Measurement and Management Symposium

Volumn , Issue , 1997, Pages 210-217

  Szekely, V ^a   Rencz, M ^a   Courtois, B ^a  

^a BUDAPEST UNIVERSITY OF TECHNOLOGY AND ECONOMICS   (Hungary)

Author keywords

[No Author keywords available]

Indexed keywords

CMOS INTEGRATED CIRCUITS; COMPUTER SIMULATION; INTEGRATED CIRCUIT LAYOUT; ONLINE SYSTEMS; RELIABILITY; SENSORS; THERMOANALYSIS;

ELECTROTHERMAL SIMULATION; TEMPERATURE SENSOR; THERMAL DESIGN;

INTEGRATED CIRCUIT TESTING;

EID: 0030735886     PISSN: 10652221     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (23)