Thermal analysis of high-power modules

IEEE Transactions on Power Electronics

Volumn 12, Issue 1, 1997, Pages 3-11

  Van Godbold, C ^a,b   Sankaran, V Anand ^a,c   Hudgins, Jerry L ^a,d  

^a IEEE   (United States)

^b UNIVERSITY OF MICHIGAN DEARBORN   (United States)

^c FORD RESEARCH LABORATORY   (United States)

^d University of South Carolina   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; ELECTRIC CONDUCTIVITY; HEAT TRANSFER; INTERFACES (MATERIALS); SUBSTRATES; THERMAL CONDUCTIVITY; THERMOANALYSIS; THICK FILMS; TRANSISTORS;

DIRECT BOND COPPER; HEAT FLOW; HIGH POWER MODULES; INSULATED METAL SUBSTRATE; THERMAL SIMULATION;

POWER ELECTRONICS;

EID: 0030735627     PISSN: 08858993     EISSN: None     Source Type: Journal    
DOI: 10.1109/63.554164     Document Type: Article

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