Packaging issues for next generation high voltage, high temperature power electronic modules

Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC

Volumn 1, Issue , 1997, Pages 413-418

  Bowers, John S ^a   Hopkins, Douglas C ^a   Sarjeant, W James ^a  

^a Custom Electronics   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; HIGH TEMPERATURE APPLICATIONS; INDUSTRIAL APPLICATIONS; INTEGRATED CIRCUIT LAYOUT; MILITARY APPLICATIONS; NETWORK COMPONENTS; NUCLEAR ENERGY; SPACE APPLICATIONS; SUBSTRATES; THERMAL CONDUCTIVITY OF SOLIDS;

COPPER INTERCONNECTS; DOWN HOLE SYSTEMS; HEAT SPREADER; POWER ELECTRONIC MODULES;

POWER ELECTRONICS;

EID: 0030735614     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (21)