Ultrasonic cure monitoring of advanced composites

International SAMPE Symposium and Exhibition (Proceedings)

Volumn 42, Issue 1, 1997, Pages 125-133

  Shepard, David D ^a   Smith, Kim R ^a  

^a Micromet Instruments   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPRESSION MOLDING; CURING; ELECTRIC CONDUCTIVITY OF SOLIDS; EPOXY RESINS; SENSORS; THERMAL CYCLING; ULTRASONIC DEVICES; ULTRASONIC MEASUREMENT;

ULTRASONIC CURE MONITORING; ULTRASONIC SENSORS;

THERMOSETS;

EID: 0030719590     PISSN: 08910138     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)