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Volumn , Issue , 1997, Pages 28-32
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Biobased epoxy resins for computer components and printed wiring boards
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Author keywords
[No Author keywords available]
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Indexed keywords
ASSEMBLY;
COMPUTERS;
COPOLYMERS;
DIELECTRIC PROPERTIES;
EPOXY RESINS;
GLASS TRANSITION;
LAMINATES;
LIGNIN;
PHENOLS;
THERMODYNAMIC STABILITY;
WASTE DISPOSAL;
COMPUTER COMPONENTS;
COMPUTER INDUSTRY;
COMPUTER MANUFACTURING;
FLAME RETARDANCY;
MOISTURE ABSORPTION;
PRINTED CIRCUIT MANUFACTURE;
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EID: 0030718849
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
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Times cited : (9)
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References (7)
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