Brazing of heat sink attachments for new electronic ceramic substrates

Ceramic Engineering and Science Proceedings

Volumn 18, Issue 4 B, 1997, Pages 137-144

  Hanson, Wendy B ^a   Fernie, John A ^a   Stockham, Norman R ^a  

^a TWI LTD   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINA; BRAZING; CERAMIC MATERIALS; ELECTRONICS PACKAGING; STRENGTH OF MATERIALS; SUBSTRATES; THERMAL CONDUCTIVITY OF SOLIDS; THERMAL EXPANSION;

ELECTRONIC CERAMIC SUBSTRATES; HEAT SINK ATTACHMENTS;

HEAT SINKS;

EID: 0030718672     PISSN: 01966219     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (9)