Development of residual stresses during thermoplastic adhesive bonding to metals

Annual Technical Conference - ANTEC, Conference Proceedings

Volumn 1, Issue , 1997, Pages 1160-1164

  Ramani, Karthik ^a   Zhao, Wenping ^a  

^a PURDUE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; ELASTICITY; HEAT TREATMENT; INTERFACES (MATERIALS); JOINTS (STRUCTURAL COMPONENTS); MELTING; RESIDUAL STRESSES; STRIP METAL; THIN FILMS; VISCOELASTICITY;

ADHESIVE BONDING; CURVATURE MODEL;

THERMOPLASTICS;

EID: 0030715766     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (9)