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Volumn , Issue , 1997, Pages 1182-1187
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Study of the thermal characteristics of a conductive adhesive chip attach process
a
a
IBM
(United States)
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Author keywords
[No Author keywords available]
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Indexed keywords
CONDUCTIVE PLASTICS;
FINITE VOLUME METHOD;
FLIP CHIP DEVICES;
HEAT CONDUCTION;
HEAT CONVECTION;
HEAT RADIATION;
HEAT TRANSFER COEFFICIENTS;
MATHEMATICAL MODELS;
SOLDERING;
TEMPERATURE DISTRIBUTION;
CHIP BONDING PROCESS;
ELECTRICALLY CONDUCTIVE ADHESIVES (ECA);
PLASTIC ADHESIVES;
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EID: 0030713763
PISSN: 05695503
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
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Times cited : (3)
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References (17)
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