Plastic-based receptacle-type VCSEL-array modules with one and two dimensions fabricated using the self-alignment mounting technique

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1997, Pages 382-390

  Kosaka, Hideo ^a   Kajita, Mikihiro ^a   Yamada, Mitsuki ^a   Sugimoto, Yoshimasa ^a   Kurata, Kazuhiko ^a   Tanabe, Takashi ^a   Kasukawa, Yasuhiko ^a  

^a NEC CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

BIT ERROR RATE; ELECTRONICS PACKAGING; FLIP CHIP DEVICES; OPTICAL FIBER COUPLING; SEMICONDUCTOR DEVICE MANUFACTURE; SUBSTRATES;

MULTIFIBER PUSH ON (MPO) FIBER CONNECTOR; VERTICAL CAVITY SURFACE EMITTING LASERS (VCSEL);

SEMICONDUCTOR LASERS;

EID: 0030713749     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (19)